| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus that is made compact in size and light in weight. SOLUTION: The semiconductor manufacturing apparatus is provided with a vacuum container 1, a chamber cover 2 that is arranged on the top of the vacuum container 1 and functions as an electrode, a gas introduction route 9 provided inside the chamber cover 2, gas distribution boards 11 and 12 that are arranged on the lower surface of the chamber cover 2 with liners 10a and 10b between, a plurality of through holes formed in the gas distribution boards, and a stage electrode 4 that is arranged opposite to the chamber cover 2 in the vacuum container 1 and on which a substrate to be treated is placed. Shower-like gas is introduced to the stage electrode 4 through the gas introduction route 9 and the through holes, and plasma is generated for treating the substrate to be treated. COPYRIGHT: (C)2004,JPO
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