发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a novel semiconductor device which includes a resistance conductive layer, and also to provide a method of manufacturing the same. SOLUTION: The method of manufacturing the semiconductor device is for manufacturing a semiconductor device wherein the resistance conductive layer 24 and a MOS transistor 200 exist in a mixed state on one and the same semiconductor layer. The method of manufacturing the semiconductor device comprises forming the resistance conductive layer 24 on a first insulation layer 22 in a resistance conductive layer formation region and then forming a protective layer 26 so as to cover the resistance conductive layer 24; and forming a gate insulation layer 14 and a gate electrode 20 in a MOS transistor formation region. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004119697(A) 申请公布日期 2004.04.15
申请号 JP20020281080 申请日期 2002.09.26
申请人 SEIKO EPSON CORP 发明人 KAYAZONO HIRONOBU
分类号 H01L27/04;H01L21/02;H01L21/822;H01L21/8234;H01L27/06;H01L27/088;(IPC1-7):H01L21/823 主分类号 H01L27/04
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