发明名称 COVER FOR ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, PIEZOELECTRIC DEVICE, MOBILE TELEPHONE UNIT AND ELECTRONIC APPARATUS USING THE SAME PIEZOELECTRIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cover for electronic components in the structure which is resistive to external impact and a method of manufacturing the same, also to provide piezoelectric device not affected by external impacts on its performance by using such a cover, and also to provide a mobile telephone and an electronic apparatus using such a piezoelectric device. SOLUTION: The cover 70 for electronic components is fixed to an electronic component in order to close the predetermined aperture of the electronic component. This cover 70 is integrally formed by laminating a transparent synthetic resin material 72 and a glass material 71. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004119625(A) 申请公布日期 2004.04.15
申请号 JP20020279828 申请日期 2002.09.25
申请人 SEIKO EPSON CORP 发明人 ENDO HIDEO
分类号 H01L41/09;H01L23/02;H01L41/18;H03H3/02;H03H9/02;H03H9/21;(IPC1-7):H01L23/02 主分类号 H01L41/09
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