| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package and a manufacturing method thereof in which cracking is reduced. SOLUTION: The semiconductor package is provided with a semiconductor wafer 3, an aluminum pad 5 located on the semiconductor wafer 3, re-wiring 7 pulled out of the aluminum pad, a sealing resin 9 covering all over the surface of the semiconductor wafer 3, a groove opened on the re-wiring 7, a conductive resin post 1b filling the groove, and a conductive resin bump 1a integrally provided on the post 1b. Thus, the post and the bump are integrally formed with a high aspect ratio and, as a result, cracking which occurs in a joint of the semiconductor package and a printed wiring board is reduced. COPYRIGHT: (C)2004,JPO
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