| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of connection by suppressing the positional deviation of a semiconductor chip. SOLUTION: At least two connection terminals 3c out of a plurality of connection terminals aligned on a substrate 3 are respectively provided with projected parts 3d which are projected to mutually opposed directions along the row direction. When positional deviation between gold bumps 1d and the connection terminals 3c of the substrate 3 is generated, two connection terminals 3c having respective projected parts 3d are inclined mutually opposed directions to the connecting direction at the time of thermocompression bonding, one connection terminal 3c having the projected part 3d is inclined and deflected in a direction different from the direction of the other connection terminals, and the inclination of the deflected connection terminal 3c acts as a stopper of the positional deviation between the connection terminals 3c and the gold bumps 1d. Consequently the positional deviation between connection terminals 3c of the substrate 3 and the gold bumps 1d on a semiconductor chip 11 can be suppressed and the connection reliability of flip chip connection can be improved. COPYRIGHT: (C)2004,JPO
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