| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thin IC card by processing a semiconductor wafer to be thin. <P>SOLUTION: A method of providing the thin IC card comprises a first step of preparing a carrier, comprising a base material and an absorption pad attached to one side of the base material; a second step of forming a wafer complex, by adhering the backside of a wafer, on which a circuit element is not formed, to the carrier; a third step of thinly processing the semiconductor wafer to be thin by spin coating its backside with etchant; a fourth step of separating the carrier, by sticking the backside of the semiconductor wafer to a dicing tape; a fifth step of dicing the semiconductor wafer into a separate semiconductor chips p; a sixth step of reducing or removing the adhesive strength of the dicing tape; a seventh step of placing the semiconductor chip on the mounting position of a card board 101; and an eighth step of producing an IC card 100 using the card board 101. <P>COPYRIGHT: (C)2004,JPO |
