| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board whose thermal expansion coefficient can appropriately be reduced. SOLUTION: The wiring board X is formed of a core layer 10 composed of a carbon fiber material 11a and a resin composition 11b comprising an inorganic filler, a laminated wiring part 20 comprising an insulating layer 21 formed on the core layer 10 and a wiring pattern 22 arranged on the insulating layer 21 and a conduction part 30 which extends in the core layer 10 in a thickness direction and which is electrically connected with the wiring pattern 22 in the laminated wiring part 20. COPYRIGHT: (C)2004,JPO |
