| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer defect inspecting apparatus for automatically determining serious defects and for reducing the observation work of defects by an operator. SOLUTION: The defect inspecting apparatus 1 comprises a defect-wiring distance measuring section 12 for measuring the distance between a defect detected by a defect determining section 9 and adjacent wiring, a comparison section 13 for comparing a measurement value that is measured by the defect - wiring distance measuring section 12 with a preset measurement value, a serious defect determining section 14 for judging whether a detected defect is serious or not based on the result of the comparison section 13, and an output section 15 for outputting various kinds of information from the serious defect determination section 14. COPYRIGHT: (C)2004,JPO
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