| 摘要 |
PROBLEM TO BE SOLVED: To provide a one-pack liquid epoxy resin composition reducing outgases which are not caused by a solvent contained in an epoxy resin or a curing agent and produced during curing causing deterioration of performances in a small-sized electronic part or an electrical part, especially a relay. SOLUTION: The one-pack liquid epoxy resin composition comprises (A) an epoxy resin, (B) a latent curing agent and (C) an imidazole compound as essential components. A cured product improving emission of the outgases which are not caused by the solvent contained in the epoxy resin or curing agent and produced during curing is obtained by using the resin composition. COPYRIGHT: (C)2004,JPO
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