发明名称 ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a flame retardant adhesive composition which has excellent adhesiveness, excellent soldering heat resistance and excellent flame retardancy, although being a non-halogenated composition. SOLUTION: This adhesive composition is characterized by comprising (A) a copolymer which comprises 15 to 35 wt. % of acrylonitrile units, 0.5 to 4 wt. % of glycidyl (meth)acrylate units, and 61 to 84.5 wt. % of the units of one or more polymerizable monomers [excluding the acrylonitrile and the glycidyl (meth)acrylate] selected from (meth)acrylic acid and its derivatives, and has a weight-average mol. wt. of≥500,000 and a glass transition point temperature of≤-5°C, (B) an epoxy resin, (C) a curing agent for epoxy resins, and (D) an aluminum-containing organic phosphorus compound. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004115612(A) 申请公布日期 2004.04.15
申请号 JP20020278950 申请日期 2002.09.25
申请人 HITACHI CHEM CO LTD 发明人 ITO TOSHIHIKO;TANAKA MASARU
分类号 C09J7/02;C09J11/06;C09J133/00;C09J133/20;C09J163/00;(IPC1-7):C09J163/00 主分类号 C09J7/02
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