| 发明名称 |
Semiconductor device having sealing structure for wide gap type semiconductor chip |
| 摘要 |
A semiconductor chip and connection ends of corresponding external electrode terminals are encapsulated with a glass based sealing material, and the semiconductor chip includes a wide gap semiconductor element, and the electrodes of the semiconductor chip are connected to the end portions of the external electrode terminals by a silver based brazing member and/or pressure contact.
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| 申请公布号 |
US2004070059(A1) |
申请公布日期 |
2004.04.15 |
| 申请号 |
US20030669558 |
申请日期 |
2003.09.25 |
| 申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
HORI YUKITAKA;SATOH KATSUMI;ASANO NORIHISA |
| 分类号 |
H01L21/338;H01L21/52;H01L21/60;H01L21/607;H01L23/29;H01L23/31;H01L23/48;H01L23/495;H01L29/12;H01L29/78;H01L29/812;(IPC1-7):H01L23/02 |
主分类号 |
H01L21/338 |
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