| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device and a method of manufacturing the same in which alignment of a semiconductor chip and a circuit substrate can be realized on the self-alignment basis, even when an elecrode pad is formed in the ultra-miniature size for the mounting through the flip-chip connection. <P>SOLUTION: Under the condition that a projected member 9 is held between dummy pads 5b, 15b provided at the opposing surfaces of the circuit substrate 1 and the semiconductor chip 11, the circuit substrate 1 and the semiconductor chip 11 are proved opposed with each other. After the projected member 9 is fused to relatively move the semiconductor chip 11 for the circuit substrate 1 with the surface tension of the projected member 9 so that the dummy pads 5b, 15b provided opposed with each other in both sides of the projected member 9 become nearest, the projected member 9 is cured again for the alignment. A bump electrode is grown with the plating process on the electrode pads 5a, 15a, respectively, formed by the semiconductor chip 11 and the circuit substrate 1 having completed the alignment in order to connect the electrode pads 5a, 15a. <P>COPYRIGHT: (C)2004,JPO</p> |
