| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-unit wiring board by which reliable wiring boards can be obtained by avoiding occurrence of fine defective adhesion at the interlayer parts of ceramic insulation layers inside a through conductor. SOLUTION: In the multi-unit wiring board, a plurality of the ceramic insulation layers 4a and 4b having wiring layers 3 formed on their surfaces are laminated, wiring board areas 5 are formed arrayed vertically and horizontally, the wiring layers 3 positioned vertically are connected via a through conductor 10 formed at the boundary of the wiring board areas 5 of the ceramic insulation layers 4a and 4b, and division grooves 8a and 8b for dividing the wiring board areas 5 are formed on an upper surface and/or a lower surface so as to cross the through conductor 10. The bottoms of the division grooves 8a and 8b are formed 10μm or more separated from the inter-layer 9 of the ceramic insulation layers 4a and 4b. Thus, occurrence of fine defective adhesion at the inter-layer 9 part of the through conductor 10 in the case of forming the division grooves 8a and 8b to obtain the reliable wiring board. COPYRIGHT: (C)2004,JPO
|
