| 摘要 |
PROBLEM TO BE SOLVED: To provide a molding material for use in commutators which causes less cracks even in a fusing process with a severe treating condition in comparison with the conventional phenolic resin molding material mainly based on a glass. SOLUTION: The phenolic resin molding material for use in commutators comprises a phenolic resin, a silicone gel and an elastomer, or the phenolic resin molding material for use in commutators comprises the phenolic resin, the silicone gel, the elastomer and an inorganic filler including a glass fiber, with preferably a part of or the whole of the above phenolic resin and the silicone gel being previously melt-kneaded. COPYRIGHT: (C)2004,JPO
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