| 摘要 |
The present invention provides a thermoelectric cooler (TEC) In one embodiment, the TEC includes a first substrate and a second substrate. In addition, the TEC includes first and second TEC elements coupled to and between the first substrate and the second substrate. Moreover, the second TEC elements have a physical parameter different from the first TEC elements. A method of manufacturing a TEC and a laser pump module incorporating the TEC or the method are also disclosed.
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