| 摘要 |
The invention relates to an assembly and method for cooling at least one electronic component or module (1) with a cooling liquid, said assembly having the flow channel part (2) of the cooling element comprised of at least two thin, thermally conductive plates, between which plates the flow channels (6) are arranged so that the surface of the flow channel part (2), which is placed against bottom surface of the component or module (1) to be cooled, conforms essentially to the bottom shape of the component or module (1) to be cooled. The flow channel part (2) is fastened against the surface of said component or module (1) to be cooled by means of at least one compressive part (3). <IMAGE> |
