| 摘要 |
The inventive circuit has at least one main substrate (HA) which is located between a first protective substrate (S1) and a second protective substrate (S2). The main substrate (HA) has at least one semiconductor component (H). A metal layer (M1, M2) is provided on surfaces of the two protective substrates (S1, S2), respectively. Said metal layers prevent the electromagnetic fields of the circuit from being emitted outwards. |
