| 摘要 |
PURPOSE: A multi chip package method of a semiconductor device is provided to be capable of producing an LOC(Lead On Chip) lead frame chip stack package without an additional equipment. CONSTITUTION: The first chip(20) is attached to an inner lead of an LOC lead frame(10). The second chip(40) is attached on the predetermined surface of the first chip. The first wire bonding process is performed on the first chip. The second wire bonding process is performed on the second chip. A package process is completed by sequentially carrying out a molding process, a laser marking process, a trim process, a flatting process, and a forming process. Preferably, the first chip is attached at the inner lead of the lead frame by using an LOC die bonder. |
