POLISHING COMPOSITION AND RINSE COMPOSITION FOR REDUCING HAZE LEVEL OF SURFACE OF SILICONE WAFER

摘要

PURPOSE: Provided are polishing composition and rinse composition effective to reduce haze level of surface of silicone wafer and process for treatment of silicone wafer using either of the polishing composition or the rinse composition. CONSTITUTION: The polishing composition used in polishing process comprises hydroxyethyl cellulose; polyethylene oxide mixed with the composition in amount of higher than 0.005wt.% but less than 0.5wt.%; alkali compound; water; and silicon dioxide. The rinse composition used in production of the silicone wafer having surface with reduced haze level also comprises hydroxyethyl cellulose; polyethylene oxide mixed with the composition in amount of higher than 0.005wt.% but less than 0.5wt.%; alkali compound; and water. The process for treatment of silicone wafer comprises polishing surface of the wafer by the polishing composition and rinsing the polished surface using the rinse composition.