Method for making a probe card with multiple contact tips for testing integrated circuits

摘要

A method of producing a tested semiconductor device comprising: providing a probe card assembly, said probe card assembly including a probe card having a plurality of electrical contacts, a probe substrate having a plurality of elongate, resilient probe elements, and a compliant interconnection structure electrically connecting ones of said electrical contacts with ones of said probe elements; providing a plurality of semiconductor devices, each of said semiconductor devices including electrical contact pads; bringing said probe elements into contact with said electrical contact pads of said semiconductor device; and testing said semiconductor devices.