| 摘要 |
A structuring method for stepped wafer or die surfaces, includes photolithographically exposing a pattern comprising at least a first pattern portion and a second pattern portion onto a surface, said surface comprising at least a first surface portion at which a tangential plane to the surface extends in a first plane and a second surface portion at which a tangential plane to the surface extends in a second plane not coinciding with the first plane. The method comprises a first exposure step, in which the first pattern portion is exposed. Therein, the first pattern portion (51, 61) is focused into a first focal plane. The method further comprises a second exposure step, in which the second pattern portion (52, 62) is exposed. Therein, the second pattern portion is focused into a second focal plane which is different from the first focal plane. <IMAGE> |
