| 摘要 |
The invention seeks to provide technology for ensuring satisfactory connections upon establishment of electrical connections between pad electrodes provided on a to-be-transferred piece and pad electrodes provided on a transfer destination substrate. A transfer chip according to the present invention is formed on a first substrate and transferred from the first substrate to a second substrate having wiring. The transfer chip serves as a transfer unit including at least a thin-film electrical circuit formed of stacked films and a plurality of pad electrodes for establishing connections between the thin-film electrical circuit and another circuit. The pad electrodes (56d and 56f) are arranged over the entire one surface of the transfer chip and cover thin-film elements or thin-film wiring included in the thin-film electrical circuit provided below the pad electrodes (56d and 56f). Accordingly, the tops (56d-1, 56d-2, and 56f-1) of rough surface portions of the pad electrodes (56d and 56f) have approximately the same height. <IMAGE> <IMAGE> |
