<p>Disclosed is a high strength, high fatigue resistance, and high wetting lead-free solder alloy comprising effective amounts of tin, copper silver, bismuth, indium, and antimony and having a melting temperature between 175-215 DEG C.</p>
申请公布号
CZ20031348(A3)
申请公布日期
2004.04.14
申请号
CZ20030001348
申请日期
2000.11.16
申请人
SINGAPORE ASAHI CHEMICAL AND SOLDER INDUSTRIES PTE
