Method of manufacturing an electronic component with a lead frame

摘要

The component has a system carrier (2) with a platform (5) on which the component is arranged. At least one abutment region (7) is provided on the platform for supporting the platform during the manufacture of the package enclosing the component and platform. The abutment region protrudes at least partially from the package. An Independent claim is included for a method of manufacturing an electronic component.