| 摘要 |
The present invention provides different schemes for reducing the size (such as thickness) of at least a semiconductor unit (such as an IC chip) which is to be packaged. It replaces, in packaging at least a semiconductor unit, conventional grinding processes by etching schemes, particularly when the thickness of the semiconductor unit approximates an expected specification. The etching process may be embodied in a way that a semiconductor unit attached to a carrier such as a substrate, or placed onto a seating apparatus such as a chip tray, and properly shielded, is etched by means of using gas such as plasma, or beams of light. The semiconductor unit packaged according to the scheme provided by the present invention can thus be immunized against the failure resulting from die crack or back-side chipping.
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