| 摘要 |
An electronic device includes a ceramic chip carrier having an opening, a SAW element chip housed in the opening, a Kovar sealing ring, which is bonded to the ceramic chip carrier by using an Ag brazing material or other suitable material such that the Kovar sealing ring encircles the opening, and a Kovar metal cap, which is placed on the Kovar sealing ring, wherein the Kovar metal cap is coated with Ni-plating which is used as a brazing material for seam-welding and bonding the Kovar metal cap to the Kovar sealing ring and the hermeticity between the metal cap and the sealing ring increases when the thickness of the Ni-plating is about 1 mum to about 2 mum.
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