发明名称 Structure evaluation method, method for manufacturing semiconductor devices, and recording medium
摘要 An initial estimated value of a process condition is set, and a structure of an element of a semiconductor device is estimated by a process simulator, after which an estimated value of a physical amount measurement value is calculated. Then, an actual measurement value of a physical amount of the element of the semiconductor device, which is obtained by an optical evaluation method, and a theoretical calculated value thereof are compared with each other, so as to obtain a probable structure of the measured semiconductor device element by using, for example, a simulated annealing, or the like. A process condition in a process for other semiconductor device elements can be corrected by using the results.
申请公布号 US6720587(B2) 申请公布日期 2004.04.13
申请号 US20020048562 申请日期 2002.02.04
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 NOZAWA KATSUYA;SAITOH TOHRU;KUBO MINORU;KANZAWA YOSHIHIKO
分类号 H01L21/205;H01L21/66;(IPC1-7):H01L31/109 主分类号 H01L21/205
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