Memory module having balanced data I/O contacts pads

摘要

A memory module having balanced data input/output contacts. A memory module includes a printed circuit board having an edge connector and a plurality of memory integrated circuits. The edge connector may be adapted for insertion into a socket of a motherboard of a computer system, for example. The edge connector includes a plurality of contact pads on both sides of the printed circuit board. The contact pads are configured to convey data signals, power and ground to and from the printed circuit board. The power and ground contact pads alternate along the edge connector. There are no more than four data signal contact pads without intervening power or ground contact pads.