| 摘要 |
An object of the present invention is to provide a ceramic bonded body comprising a ceramic substrate and a ceramic body such as a cylindrical body firmly bonded to each other and excellent in corrosion resistance in the ceramic substrate for the use for a semiconductor product producing/examining step. The ceramic bonded body according to the present invention comprises: a ceramic substrate in which a conductor is provided; and a ceramic body bonded to a bottom face of the ceramic substrate The ceramic bondedbody has a region, where no conductor is formed, in at least a part of a region above a bonding interface between the ceramic substrate and the ceramic body. <IMAGE> |
