SEMICONDUCTOR PACKAGE ALIGNING APPARATUS

摘要

PURPOSE: A semiconductor package aligning apparatus is provided to be capable of improving process efficiency and reducing the generation of failure. CONSTITUTION: A semiconductor package aligning apparatus(200) is used for aligning a semiconductor package(10) at a boat(20) according to a predetermined reference. The semiconductor package aligning apparatus includes a vacuum hole(222) formed at its center portion for fixing the semiconductor package using vacuum force, a plurality of guide blocks(224) formed at its edge portions for guiding the semiconductor package and a support part(220) for moving up and down. At this time, the upper portions of the guide blocks are sloped toward the center portion of the semiconductor package aligning apparatus. Preferably, four guide blocks are formed at the semiconductor package aligning apparatus.