Semiconductor device and method of manufacturing the same

摘要

In a semiconductor device, an insulating substrate has a plurality of through holes. A plurality of conductive posts are buried in the through-holes. The conductive posts are classified to at least one first conductive post and a pair of second conductive posts. A semiconductor element has at least one surface electrode at a surface side. The surface electrode is connected to the first conductive post by a face-down method. A metal block is formed to a square-arch shape in a cross sectional view and has a ceiling portion and both end portions. A back surface of the semiconductor element is secured to the ceiling portion while the both end portions are secured to the second conductive posts. A sealing-resin seals the semiconductor element.