发明名称
摘要 Disclosed is a method for making an air bridge in an electronic device. This method uses amorphous silicon carbide to protect electrical conductors in the device during formation of the bridge. The silicon carbide also provides hermetic and physical protection to the device after formation. <IMAGE>
申请公布号 KR100415338(B1) 申请公布日期 2004.04.13
申请号 KR19960047594 申请日期 1996.10.23
申请人 发明人
分类号 H01L21/31;H01L23/522;H01L21/768;H01L23/482;H01L23/532;H01L23/538 主分类号 H01L21/31
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