CONDUCTIVE PASTE AND FORMATION METHOD OF ELECTRODE PATTERN USING THE CONDUCTIVE PASTE TO INHIBITING ADHESIVE STRENGTH BETWEEN HOT WIRE AND LEAD LINE ADHERED TO THE HOT WIRE BY PREVENTING DETERIORATION OF WETTABILITY OF SOLDER IN HOT WIRE

摘要

PURPOSE: A conductive paste and a method for forming an electrode pattern by using the conductive paste are provided, to obtain an electrode showing excellent wettability of solder, free from the deterioration of adhesive strength and having high resistivity. CONSTITUTION: The conductive paste comprises silver powder; a glass frit; an organic vehicle; and optionally a resistance control agent comprising a metal oxide, wherein 50 wt% or more of the silver powder has a diameter of 4.5-7 micrometers and the silver powder has a crystalline particle diameter of 100 nm or more. The method comprises the steps of preparing the conductive paste; printing the conductive paste on a substrate in a certain pattern; and sintering the conductive paste to form an electrode pattern of a certain shape on the substrate. Preferably the sintering is carried out at 600-700 deg.C and the substrate is a glass substrate.