METHOD FOR POLISHING ORGANIC LAYER SUCH AS RESIST OR THE LIKE ON SEMICONDUCTOR SUBSTRATE BY USING RESIN PARTICLES AND SLURRY FOR USE IN POLISHING

摘要

PURPOSE: A method for polishing an organic layer such as a resist or the like on a semiconductor substrate by using resin particles and slurry for use in polishing is provided to polish uniformly a resist layer by performing a chemically and mechanically polishing method using the slurry including the resin particles. CONSTITUTION: A method for polishing an organic layer includes a process for polishing a semiconductor substrate(11) having an exposed organic layer by using slurry containing resin particles. In the method for polishing the organic layer, the organic layer is formed with a resist layer(13,141-146,151-156). The polishing method further includes a process for chemically and mechanically polishing the organic layer by using the slurry containing the resin particles.