COOLING DEVICE HAVING MICRO STRUCTURE FOR COOLING TARGET BY USING THERMAL CONDUCTION CONTACT AND UTILIZING METHOD THEREOF

摘要

PURPOSE: A cooling device having a micro structure and a utilizing method thereof are provided to enhance the productivity by optimizing the micro structure of the cooling structure. CONSTITUTION: A cooling device(3) for cooling a cooling target(4) includes a base plate(5) which is thermally connected to the cooling target through two or more metal layers(1) and a heat contact side(6). The metal layers include a cooling medium channel(2). The cooling medium channel has a width of 100 to 2000 micrometers, a depth of 25 to 1000 micrometers, and an average gap of 50 to 1000 micrometers. A thickness of the remaining layer due to the cooling medium channel within the metal layers belongs to a range of 50 to 300 micrometers. The base plate has a thickness corresponding to a range of 200 to 2000 micrometers.