发明名称 |
BONDING METHOD AND PRODUCT |
摘要 |
The present invention relates to a method of anodic bonding a first structure (14) to a glass layer (12). The method comprises the steps of arranging a conductive pattern (11) on a substrate, providing the glass layer on said conductive pattern (11), providing said first structure on said glass layer (12), providing an electrode on one side of said first structure, and applying a voltage to said conductive pattern and said electrode to obtain an electrical field across said first structure and said glass layer, between said conductive pattern (11) and said electrode (15) produce an anodic bonding between said first structure and said glass layer.
|
申请公布号 |
WO03006396(B1) |
申请公布日期 |
2004.04.08 |
申请号 |
WO2002SE01371 |
申请日期 |
2002.07.09 |
申请人 |
IMEGO AB;BERGSTEDT, LEIF;PERSSON, KATRIN |
发明人 |
BERGSTEDT, LEIF;PERSSON, KATRIN |
分类号 |
B81C1/00;H01L21/58;H05K1/03;H05K3/28;(IPC1-7):C03C27/00;H05K3/00;H01L21/473 |
主分类号 |
B81C1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|