| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To make thin a semiconductor package having a photoelectric conversion region such as a CCD, and to improve its productivity. <P>SOLUTION: On a transparent adhesive layer 8 on a glass substrate 9 having a size in response to a plurality of semiconductor packages, silicon substrates 1 each having a photoelectric conversion region in the undersurface are adhered away from each other. Under the peripheral part of the undersurface of each silicon substrate 1 and its surrounding part, connecting wiring 7 connected to a connection pad 3 of the silicon substrate 1 is arranged. After an insulating film 6, rewiring 11, columnar electrodes 12, a sealing film 13 and solder balls 14 are formed, the package is cut between the silicon substrates 1 into the plurality of semiconductor packages each having a photoelectric conversion region 2. <P>COPYRIGHT: (C)2004,JPO</p> |
