MOUNTING STRUCTURE, MOUNTING METHOD AND REMOVING METHOD OF ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide the mounting structure, facilitated in the removal of an electronic component, and the mounting method, and to provide a removing method of the electronic component. SOLUTION: Upon removing the electronic component, a film, pinched between the electronic component and a substrate, is peeled off whereby the electronic component is removed easily and, further, damage due to direct peeling will not be given to the electronic component or the substrate, since the electronic component does not require strong retention. COPYRIGHT: (C)2004,JPO