| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed board provided with a structure where high density mounting is realized and reliability is secured even when physical stress is applied from outside etc. <P>SOLUTION: Laminating a plurality of resin films 23 and 21 including a conductor pattern film 21 consisting of a thermoplastic resin and pressurizing them while heating, the films 23 and 21 are pasted to each other to be molded multilayered. A board area consisting of the plurally laminated films 23 and 21 is provided with an interlayer joint part BJ where the films 23 and 21 adjacent in a laminated direction are stuck and joined to each other, and an interlayer no-joint part BE where the films 23 and 21 adjacent in the laminated direction are weakly bonded or not bonded at all to each other. The interlayer no-joint part BE is provided at a part to which the physical stress is applied from outside etc. <P>COPYRIGHT: (C)2004,JPO</p> |
