| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability by making solder of the side-wall part of a substrate and a lid very firm so as to effectively prevent water from entering inside to make a semiconductor device operate normally and stably for a long period. SOLUTION: The package for housing the semiconductor device is provided with the resin substrate 1 provided with a mounting part 3 for mounting the semiconductor device 5 on the bottom surface of a recess part 1b formed on an upper surface, a metallizing layer 2a adheres to the whole periphery of the upper surface of the side wall part 2 of the substrate 1, and a lead terminal 7. The metallizing layer 2a has a width of 0.2 to 5 mm and is made to adhere to the upper face of the side wall part 2 so as to avoid reaching the end of the inner surface side and the end of the outer surface side of the side wall part 2. As for the lid 9, a metallic layer 9a covering the metallized layer 2a is made to adhere to the whole periphery of the outer periphery part of a lower surface. COPYRIGHT: (C)2004,JPO |
