| 摘要 |
PROBLEM TO BE SOLVED: To provide a leadframe etching method demanding but a relatively simplified apparatus constitution and yet capable of achieving accurate dimensions even in the case of a fine-pitch leadframe, and to provide an apparatus therefor. SOLUTION: A metallic lamella 10, coated with resist films patterned as prescribed on its top and bottom surfaces, is horizontally transferred from the upstream side to the downstream side, and an etching liquid is sprayed from a plurality of spray nozzles 14, 15, arranged facing the top and bottom surfaces of the metallic lamella 10 and arrayed in the travelling direction of the metallic lamella 10, onto the top and bottom surfaces of the metallic lamella 10 for the formation of leadframes. Gas ejection nozzles 20, 21 are provided for one or more of the spray nozzles 14 facing the top surface, and, etching liquid collecting on the metallic lamella 10 is expelled rightward and leftward relative to the travelling direction of the metallic lamella 10 by gas currents blown out of the gas ejection nozzles 20, 21 for the accomplishment of etching. COPYRIGHT: (C)2004,JPO |
