发明名称 SINTERING METHOD USING TUNGSTEN-COPPER COMPOSITE POWDER, SINTERED COMPACT AND HEAT SINK
摘要 PROBLEM TO BE SOLVED: To provide a sintering method for obtaining a sintered compact having a high thermal conductivity by using a metal sintered compact material having excellent sinterability. SOLUTION: The method for producing a sintered compact comprises a process where tungsten-copper composite powder obtained by coating tungsten with copper is molded by a metal powder injection molding method, and is then subjected to degreasing and sintering. In the method, a sintering assistant is regulatively used so as to substantially highly hold the thermal conductivity of the sintered compact. The content of the sintering assistant is controlled to≤70 ppm in the whole of the tungsten-copper composite powder including the sintering assistant. Further, the content of iron in the sintering assistant is controlled to≤30 ppm, nickel to≤20 ppm and cobalt to≤20 ppm in the whole of the tungsten-copper composite powder including the sintering assistant. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004107772(A) 申请公布日期 2004.04.08
申请号 JP20020274971 申请日期 2002.09.20
申请人 SEIKO EPSON CORP 发明人 NAKAMURA HIDEFUMI;TAKEI ATSUKI
分类号 B22F3/10;B22F3/02;B22F3/24;C22C27/04;(IPC1-7):B22F3/10 主分类号 B22F3/10
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