发明名称 |
CATALYTIC CHEMICAL VAPOR DEPOSITION METHOD AND CATALYTIC CHEMICAL VAPOR DEPOSITION DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a catalytic chemical vapor deposition method and a catalytic chemical vapor deposition device in which the control of a substrate temperature can easily be performed without the limitation of substrate materials, the efficiency of energy is high while increasing a thin film deposition rate, and the stabilization of film performance is possible. SOLUTION: In the catalytic chemical vapor deposition method where a deposition precursor formed by decomposing at least a part of a gaseous starting material with a heated catalyst body consisting of a metal or an intermetallic compound is deposited on a substrate to form a thin film, as the catalyst body, the one whose surface has been subjected to ruggedness formation treatment is used. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004107766(A) |
申请公布日期 |
2004.04.08 |
申请号 |
JP20020274638 |
申请日期 |
2002.09.20 |
申请人 |
JAPAN ADVANCED INST OF SCIENCE & TECHNOLOGY HOKURIKU;SONY CORP |
发明人 |
MASUDA ATSUSHI;NADA NAOJI |
分类号 |
B01J23/30;B01J37/00;C23C16/44;(IPC1-7):C23C16/44 |
主分类号 |
B01J23/30 |
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