发明名称 POLYAMIDE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyamide composition which has a low friction coefficient, a low water absorptivity, and a high critical PV value and is excellent in sliding characteristics, mechanical strength, heat resistance, and dimensional stability; and a molded article prepared therefrom. SOLUTION: The polyamide composition is prepared by incorporating 0.1-30pts.wt. silicone (B) into 100pts.wt. polyamide (A) composed of dicarboxylic acid units containing 50-100mol% terephthalic acid units and diamine units containing 50-100mol% 6-18C aliphatic alkylenediamine units. The molded article is prepared from the composition. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004107526(A) 申请公布日期 2004.04.08
申请号 JP20020273475 申请日期 2002.09.19
申请人 KURARAY CO LTD 发明人 OKA HIDEAKI;SASAKI SHIGERU
分类号 C08J5/00;C08G69/26;C08K3/00;C08L77/06;(IPC1-7):C08L77/06 主分类号 C08J5/00
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