发明名称 Wiring substrate and method for manufacturing the same
摘要 A wiring substrate of the present invention includes a short ring (SR) formed along a periphery of the substrate, an independent line pattern (e.g., a gate terminal) that is coplanar with and independent of SR, a continuous line pattern (e.g., a storage capacitor stem) that is located closest to the independent line pattern and is coplanar and continuous with SR, and an insulating film covering the independent line pattern and the continuous line pattern. The insulating film includes a first through hole reaching the independent line pattern and a second through hole reaching the continuous line pattern.
申请公布号 US2004066637(A1) 申请公布日期 2004.04.08
申请号 US20030664158 申请日期 2003.09.17
申请人 发明人 IMAI HAJIME;SUGIMOTO OSAMU;OKADA KATSUHIRO;OGASAWARA ISAO
分类号 G02F1/1345;G02F1/1362;G02F1/1368;H01L21/77;H01L21/84;H01L27/12;H01L51/52;H05K1/11;(IPC1-7):H05K7/02;H05K7/06;H05K7/08;H05K7/10 主分类号 G02F1/1345
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