发明名称 HEAT TREATMENT APPARATUS
摘要 <p>A heat treatment apparatus comprises a heating furnace main body having an opening portion in the upper end, a reaction tube formed of a single tube received inside the heating furnace main body, gas exhaust means connection portion shaped in a reduced diameter form at the upper portion of the reaction tube, a to-be-processed substrate support member for supporting a substrate to be processed, and heating means for heating a substrate to be processed supported by the to-be-processed substrate support member. The heating means has first heating portions arranged around the reaction tube, second heating portions arranged around the gas exhaust means connection portion, third heating portion circumferentially arranged above the reaction tube, fourth heating portions circumferentially arranged below the lower portion of the reaction tube, and a fifth heating portion provided under the to-be-processed substrate support member.</p>
申请公布号 WO2004030061(A1) 申请公布日期 2004.04.08
申请号 WO2003JP11100 申请日期 2003.08.29
申请人 TOKYO ELECTRON LIMITED;SAITO, TAKANORI;YAMAGA, KENICHI;NAKAO, KEN 发明人 SAITO, TAKANORI;YAMAGA, KENICHI;NAKAO, KEN
分类号 H01L21/22;H01L21/00;H01L21/205;(IPC1-7):H01L21/22;H01L21/31 主分类号 H01L21/22
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