| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that comprises a semiconductor chip and a member for drawing an electrical conductor out of the semiconductor chip, to provide a member for a semiconductor package used for the semiconductor device, and to provide a method for manufacturing the semiconductor package for turning into higher frequency/higher speed. <P>SOLUTION: The semiconductor device comprises a wiring board, and a semiconductor chip which is provided on the wiring board and comprises a pad electrically continual to the wiring on the wiring board. Passive elements are integrated at positions facing to the side of the semiconductor chip on the wiring board, with either of both ends of the passive element being connected to the pad for external connection. A second semiconductor chip is electrically continuous with the wiring on the wiring board where at least one of the pads for external connection is electrically continuous with the pad of a semiconductor chip. <P>COPYRIGHT: (C)2004,JPO |
