| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a double-sided polishing device by which the load of an upper lap can be applied to each workpiece evenly, and a carrier is prevented from becoming a large size, by retaining each of a plurality of sheets of the workpieces arranged between the upper lap and a lower lap within a visible-through hole when the workpiece is polished by making the carrier perform small circle motion. <P>SOLUTION: The double-sided polishing device for polishing both the sides of the workpiece W sandwiched between the upper and lower laps 10 and 12 of which the one at least is forced to rotate in a prescribed direction is characterized in that a control part 1 for controlling carrier driving means 30, 40 is provided with the plurality of sheets of the carriers 26 on which the visible-through hole is formed which is used for retaining the workpiece W arranged at the periphery of the center of gravity in the upper lap 10 and sandwiched between the upper and lower laps 10 and 12, and the carrier driving means 30, 40 for driving each carrier 26 independently with each other so that each carrier 26 can carry out the small circle motion or rocking motion without any rotation, and when each carrier 26 carries out the small circle motion or the rocking motion, each center of gravity in the workpiece W retained on the carrier 26 is movable so that it can be moved by the same distance in the accessing direction simultaneously or in the separating direction simultaneously against the center of gravity in the upper lap 10. <P>COPYRIGHT: (C)2004,JPO |
