| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition and a photosensitive element excellent in resolution, to provide a method for manufacturing a resist pattern layered substrate on which a resist pattern with excellent resolution is formed, and moreover, to provide a method for manufacturing a printed wiring board by using a resist pattern with excellent resolution. <P>SOLUTION: The photosensitive resin composition comprises (A) a binder polymer; (B1) polyoxyethylene di(meth)acrylate, (B2) 2,2-bis(4-((meth)acryloyl oxypolyalkyleneoxy)phenyl)propane having at least each one of ethoxy group and propoxy group in the molecule; and (C) a photopolymerization initiator. <P>COPYRIGHT: (C)2004,JPO |
