发明名称 MANUFACTURING METHOD OF WIRING CIRCUIT SUBSTRATE
摘要 <p><P>PROBLEM TO BE SOLVED: To improve the uniformity of thickness of a wiring substrate by pressurizing with a uniform pressurizing force to obtain good electric connection between a bump and a metal foil or a metal sheet. <P>SOLUTION: A press having a pressurizing unit 41 for pressurizing a pressurizing surface plate 46 by a hydraulic pressure by supplying oil into a space 48 for a hydraulic pressure, which is provided between a pressurizing main body 44 and the pressurizing surface plate 46, and a heating stage 40 opposed to the pressurizing unit 41, is employed. A work to be pressurized 58 is arranged between the pressurizing surface plate 46 and the heating stage 40 under a condition of being superposed, then, pressurizing fluid is supplied into the space 48 (a second pressurizing condition) under a condition (a first pressurizing condition) that one side of the superposed works is contacted with the pressurizing surface plate 46 while the other side of the same is contacted with the heating stage 40 to pressurize the superposed works and laminate them. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004111651(A) 申请公布日期 2004.04.08
申请号 JP20020272157 申请日期 2002.09.18
申请人 NORTH:KK;KITAGAWA ELABORATE MACH CO LTD 发明人 OHIRA HIROSHI;IIJIMA ASAO;MATSUMOTO MASAKI;OKAZAKI SHIZUAKI
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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